Chris,

Your interpretation is correct in that the requirement for 2 layer buried via cores for Class 3/A is 20 microns (787 microinches) or as we tell our lab technicians, "look for 0.0008" minimum".

We also include electroless copper into the measurement for surface, hole & wrap plating.  IPC-6012 does not distinguish between types of copper when specifying the copper thickness requirement.  Eltek and any other companies that are not including the electroless copper should ensure to specify that in the procurement documentation to their suppliers.

Best regards,

Scott A. Bowles
Director of Engineering and Quality
Hallmark Circuits, Inc.
13500 Danielson Street
Poway, CA 92064

858 513-2200 Office x8848
858 513-2233 Fax
858 437-7827 Cell


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-----Original Message-----
From: Chris Mahanna [mailto:[log in to unmask]]
Sent: Tuesday, August 24, 2010 5:52 PM
To: [log in to unmask]
Subject: [IPC-600-6012] wrap and electroless

another opinion poll, of sorts:
With even the most discriminating customers allowing 0.0002" wrap, and huge aspect ratios leading to thicker electroless,  the assumption that wrapped electroless counts as wrap becomes more and more important.  I assume that everyone is counting it?

Thanks,
Chris

Chris Mahanna
President, Technical Manager
Robisan Laboratory Inc.
6502 E. 21st Street
Indianapolis, Indiana 46219
317-353-6249


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