I also agree - IPC-6012C defines it better and points to the tables.

Denise J Chevalier
Amphenol Printed Circuits
Quality Engineer
Phone - 603-324-4530
Fax - 603-386-6442
 
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-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Karl
Sauter
Sent: Tuesday, August 24, 2010 8:59 PM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] 6012B class 3/a buried

Chris,

I agree with this interpretation.

Regards,
Karl Sauter


On 8/24/2010 5:45 PM, Chris Mahanna wrote:
> We have assumed that the reduced hole-wall plating requirement for (in
particular 6012B 3/A) buried of 0.0008" applies to cores (2 layers)
only.
> May I have some feedback?  Don't worry about hurting my feelings- I've
wrong before, just ask my wife.
>
> Chris
>
>
> Chris Mahanna
> President, Technical Manager
> Robisan Laboratory Inc.
> 6502 E. 21st Street
> Indianapolis, Indiana 46219
> 317-353-6249
>
>
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-- 
Oracle <http://www.oracle.com>
Karl Sauter | Principal Engineer
Phone: +14082763207 <tel:+14082763207>
4150 Network Circle, MS: SCA16-101 | Santa Clara, California 95054
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