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Reply To: | (Combined Forum of D-33a and 7-31a Subcommittees) |
Date: | Wed, 25 Aug 2010 07:17:22 -0500 |
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The electroless is expected to meet the rigors of thermal stress just as
the electrolytic plated copper, so, yes, it should be counted. As to the
difference in mechanical properties of electroless from electrolytic
copper, that's one of the reasons we have moved to direct metal. I don't
recall one thermal shock failure at the interconnect (assuming no smear is
present) since we qualified our process.
Tom Kemp
Rockwell Collins Printed Circuits
Jose A Rios <[log in to unmask]>
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08/25/2010 06:40 AM
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Re: [IPC-600-6012] wrap and electroless
you cant see enough electroless in a microsection to measure it, even at
500 or 1000x unless you're really 'globbing it on'.
if you're counting on eless to meet the wrap requirement, thats a loosing
proposition. at least for 'medium-build' eless chemistry setups.
in the event a 'high-build' eless application is employed, and the deposit
is measurable, i dont see why you cant count it toward meeting the wrap
requirement....
Joey Rios
PWB & Process Quality Eng'r
Endicott Interconnect Technologies
1093 Clark St.
Endicott, NY 13760
Office: 607-755-5896
Chris Mahanna <[log in to unmask]>
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08/24/2010 08:52 PM
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[IPC-600-6012] wrap and electroless
another opinion poll, of sorts:
With even the most discriminating customers allowing 0.0002" wrap, and
huge aspect ratios leading to thicker electroless, the assumption that
wrapped electroless counts as wrap becomes more and more important. I
assume that everyone is counting it?
Thanks,
Chris
Chris Mahanna
President, Technical Manager
Robisan Laboratory Inc.
6502 E. 21st Street
Indianapolis, Indiana 46219
317-353-6249
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