Subject: | |
From: | |
Reply To: | (Combined Forum of D-33a and 7-31a Subcommittees) |
Date: | Mon, 16 Aug 2010 10:49:17 -0700 |
Content-Type: | text/plain |
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Chris,
The second picture looks like a burned demarcation from the micro-etch; possibly some plating separation. The first picture looks like plating separation and a plating crack.
Best Regards.
Russ Shepherd
Director PCB\PWB Test Programs
Microtek Laboratories
1435 Allec Street
Anaheim, CA 92805
(714) 999-1616
www.thetestlab.com
-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Chris Mahanna
Sent: Monday, August 16, 2010 10:41 AM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] opinion poll
Hi Lance,
No solder
Let me add another picture to the story.
-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Lance A Auer
Sent: Monday, August 16, 2010 1:35 PM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] opinion poll
Chris,
I think your picture shows an "E" crack and the initial plating
has separated from the copper that was subsequently plated. Is that
solder in the area where the platings are separated?
Thanks,
Lance
From:
Chris Mahanna <[log in to unmask]>
To:
[log in to unmask]
Date:
08/16/2010 10:21 AM
Subject:
[IPC-600-6012] opinion poll
Sent by:
IPC-600-6012 <[log in to unmask]>
Hi Everyone,
Attached is a picture of a thru-hole corner after thermal stress. The plating is pulse. I believe the corner was 'burnt' because of the geometry of the (conformant) negative etchback. All the corners show burn; some show blisters; only this one cracked.
In your opinion, what are the non-conformance(s) if any?
Thanks
Chris
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