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Reply To: | (Combined Forum of D-33a and 7-31a Subcommittees) |
Date: | Tue, 17 Aug 2010 17:39:44 -0400 |
Content-Type: | text/plain |
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going back to 6012b, the extra copper thickness provision required by 3/a
is in the context of pth thickness.
with the updated 3/a table in 6012c, that context isnt explicitely stated,
i dont recall the intent to apply increased copper thickness to surface
wrap, only to pth's.
Joey Rios
PWB & Process Quality Eng'r
Endicott Interconnect Technologies
1093 Clark St.
Endicott, NY 13760
Office: 607-755-5896
Wendi Boger <[log in to unmask]>
Sent by: IPC-600-6012 <[log in to unmask]>
08/17/2010 05:07 PM
Please respond to
"(Combined Forum of D-33a and 7-31a Subcommittees)" <[log in to unmask]>
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Subject
[IPC-600-6012] Class 3/A requirements
I need some clarification on the requirement for Plating/Coating
Thickness. The 3/A page requires additional copper thickness above
class 3 to be added to tables 3-3, 3-4 and 3-5. Does this also apply to
the minimum wrap thickness? (Example) Is it required for a
non-conductive filled through via to have .944 mils of wrap (table 3-3)?
It's a bit confusing as it says to apply to minimum copper average and
minimum thin areas.
Wendi
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