Hi Jon - yes, the flux system that is a constituent of the Indium SMQ92J
solder paste is compatible for soldering to Pd surfaces. I recommend
focusing your investigation on the time/temperature elements of your
soldering process recipe. You also detailed that some of the components
are at least 3 years old so running a solderability test to assess the
wetting characteristics would also be beneficial. Good Luck.
Dave
"Roberts, Jon \(SA-1\)" <[log in to unmask]>
08/25/2010 10:36 AM
To
"Stadem, Richard D." <[log in to unmask]>, "TechNet E-Mail Forum"
<[log in to unmask]>, <[log in to unmask]>
cc
Subject
RE: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT PARTS
The intermetallic formation is the tin and nickel that you want,
correct? We use NC-SMQ(r)92J solder paste, in case this is helpful here
to know, Thanks, Jon
-----Original Message-----
From: Stadem, Richard D. [mailto:[log in to unmask]]
Sent: Wednesday, August 25, 2010 10:07 AM
To: Roberts, Jon (SA-1); TechNet E-Mail Forum;
[log in to unmask]
Subject: RE: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT
PARTS
I agree with Dave Hillman's response. I also want to point out that an
RMA flux is a not a good match with these type of components, because of
the fact that you need to solder a little hotter for a little longer,
and this increases the amount of RMA flux residues that are baked onto
the CCA/component leads during reflow. RMA is tough enough to clean at
normal reflow times/temps if a water wash with solvent addition is used.
Also, another little note. The palladium is only partially dissolved
when soldering, it is there as a barrier to help prevent a reaction
between the gold and the nickel during the final gold plating. During
reflow the gold is readily wetted into the solder joint, the palladium
slightly less so, but nickel's rate of dissolution into the solder is
what is much slower and also requires the increase in time/temp. The
palladium needs to be totally dissolved so as to allow an intermetallic
formation with the nickel. While you can solder to the palladium, you
are then depending on the palladium's plated bond to the nickel, and
this is typically not very good.
-----Original Message-----
From: Roberts, Jon (SA-1) [mailto:[log in to unmask]]
Sent: Wednesday, August 25, 2010 9:20 AM
To: Stadem, Richard D.; TechNet E-Mail Forum;
[log in to unmask]
Subject: RE: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT
PARTS
Dave Hillman assumed correctly. I had in the subject matter, just goof
trying to type the Pd. Middle finger was too slow and let my index
finger take over. Are you in agreement with Dave Hillman response?
Little more information related to the issue:
This affects several SMT OPA part numbers with the same
finish.
Have some in stockroom for over 3 years, so cannot send
back to
vendor.
Have to use an RMA No Clean type flux (ROL0) (We clean).
I have provided recommendation to those working the corrective action
that was issued to manufacturing.
Those included:
1. Sending a sample to have the analyses both for any
contamination and solderability. We could perform the second one here
but I recommended an outside lab due it.
2. Measure the lead temperature during a reflow cycle.
3. Measure the lead temperature during the hand solder
process
that uses a soldering iron and liquid RMA No Clean flux (ROL0).
4. Send the necessary quantity from stock prior to the
next
build to have pre-tinned and at that time the source we use can use a
stronger flux, if necessary and are able to clean
properly
prior to putting back on tape and reel.
Also we have had this issue several times before and the solution was to
rework/replace the parts but it was in smaller lot sizes. Now it is
larger lot sizes being processed and affected.
Again I thank those on IPC TechNet and their expertise. Jon
-----Original Message-----
From: Stadem, Richard D. [mailto:[log in to unmask]]
Sent: Tuesday, August 24, 2010 4:55 PM
To: TechNet E-Mail Forum; [log in to unmask]; Roberts, Jon
(SA-1)
Subject: RE: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT
PARTS
Well, jeez, Dave. You beat me to it again. Except I was busy trying to
find my references to soldering with platinum, not palladium.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Tuesday, August 24, 2010 4:13 PM
To: [log in to unmask]
Subject: Re: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT
PARTS
Hi Jon! There are a couple things to remember when dealing with NiPdAu
surface finishes: 1) Pd diffuses very slowly into a tin/lead solder
alloy.
You may need to add a few seconds to your soldering process cycle time;
2)
Adding an additional 5-10C of temperature will assist in the Pd
diffusion
into the tin/lead solder alloy. You may need to increase your soldering
temperature depending on which soldering process you are using; 3) Some
flux material are not compatible with Pd materials. You may want to try
a
different flux to see if you get an improved reaction; 4) Run a
solderability test per IPC JSTD 002 to make sure you have an acceptable
NiPdAu surface finish. When Texas Instruments first introduced the
NiPdAu
surface finish, we had to make slight time/temperature/flux adjustments
on
our typical soldering processes to obtain our expected soldering
results.
Good Luck.
Dave Hillman
Rockwell Collins
[log in to unmask]
"Roberts, Jon (SA-1)" <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
08/24/2010 12:41 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
"Roberts, Jon (SA-1)" <[log in to unmask]>
To
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Subject
[TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT PARTS
Have any of you experience difficulty in producing an acceptable solder
joint with Nickel platinum gold SMT lead finishes? We can rework at
least twice to achieve an acceptable condition. Lead free part but we
use a solder with lead. Any help is appreciated. Jon
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