Hi! Yes, I made the assumption that Jon really meant Pd and not Pt as I
haven't run into a NiPtAu surface finish on components yet.
Dave
"Stadem, Richard D." <[log in to unmask]>
08/24/2010 04:54 PM
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TechNet E-Mail Forum <[log in to unmask]>, "[log in to unmask]"
<[log in to unmask]>, "Roberts, Jon (SA-1)"
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Subject
RE: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT PARTS
Well, jeez, Dave. You beat me to it again. Except I was busy trying to
find my references to soldering with platinum, not palladium.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Tuesday, August 24, 2010 4:13 PM
To: [log in to unmask]
Subject: Re: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT
PARTS
Hi Jon! There are a couple things to remember when dealing with NiPdAu
surface finishes: 1) Pd diffuses very slowly into a tin/lead solder alloy.
You may need to add a few seconds to your soldering process cycle time; 2)
Adding an additional 5-10C of temperature will assist in the Pd diffusion
into the tin/lead solder alloy. You may need to increase your soldering
temperature depending on which soldering process you are using; 3) Some
flux material are not compatible with Pd materials. You may want to try a
different flux to see if you get an improved reaction; 4) Run a
solderability test per IPC JSTD 002 to make sure you have an acceptable
NiPdAu surface finish. When Texas Instruments first introduced the NiPdAu
surface finish, we had to make slight time/temperature/flux adjustments on
our typical soldering processes to obtain our expected soldering results.
Good Luck.
Dave Hillman
Rockwell Collins
[log in to unmask]
"Roberts, Jon (SA-1)" <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
08/24/2010 12:41 PM
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TechNet E-Mail Forum <[log in to unmask]>; Please respond to
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[TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT PARTS
Have any of you experience difficulty in producing an acceptable solder
joint with Nickel platinum gold SMT lead finishes? We can rework at
least twice to achieve an acceptable condition. Lead free part but we
use a solder with lead. Any help is appreciated. Jon
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