Thanks, this is helpful. I was going to ask manufacturing to obtain the
actual temperature of the lead during the reflow process and then
measure it during hand soldering.  I wanted to know if the temperature
of hand soldering was slightly higher allowing the wetting action to
improve.  Jon


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Tuesday, August 24, 2010 4:13 PM
To: [log in to unmask]
Subject: Re: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT
PARTS

Hi Jon! There are a couple things to remember when dealing with NiPdAu 
surface finishes: 1) Pd diffuses very slowly into a tin/lead solder
alloy. 
You may need to add a few seconds to your soldering process cycle time;
2) 
Adding an additional 5-10C of temperature will assist in the Pd
diffusion 
into the tin/lead solder alloy. You may need to increase your soldering 
temperature depending on which soldering process  you are using; 3) Some

flux material are not compatible with Pd materials. You may want to try
a 
different flux to see if you get an improved reaction; 4) Run a 
solderability test per IPC JSTD 002 to make sure you have an acceptable 
NiPdAu surface finish. When Texas Instruments first introduced the
NiPdAu 
surface finish, we had to make slight time/temperature/flux adjustments
on 
our typical soldering processes to obtain our expected soldering
results. 
Good Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]




"Roberts, Jon (SA-1)" <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
08/24/2010 12:41 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
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Subject
[TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT PARTS






 Have any of you experience difficulty in producing an acceptable solder
joint with Nickel platinum gold SMT lead finishes?  We can rework at
least twice to achieve an acceptable condition.  Lead free part but we
use a solder with lead.  Any help is appreciated.  Jon


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