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"Wenger, George M." <[log in to unmask]>, [log in to unmask]
Date:
Thu, 26 Aug 2010 08:43:02 -0500
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TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Subject:
From:
"David D. Hillman" <[log in to unmask]>
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Hi George - excellent information!  I didn't realize the overall cost 
savings on the component fab process was that extensive. You also reminded 
me that there was a large NCMS printed wiring boards surface finish 
consortium effort in the late 80s (?) which you, Jim Reed of TI , and 
others participated in which produced some very good early data on the 
impact of Pd as a potential pwb surface finish. Some of the Pd 
embrittlement and solderability shelf life data used by the industry came 
out of the work that you conducted. Some of that data was published at the 
IPC Surface Finishes Conferences. Did it get published elsewhere?

Dave



"Wenger, George M." <[log in to unmask]> 
08/26/2010 08:34 AM

To
"[log in to unmask]" <[log in to unmask]>
cc

Subject
RE: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT PARTS






Dave,

You knowledge of the PdNiAu history is similar to mine.I'd go one step 
further and say that TI pushed PdNi because it was a big cost saving, 
except for the period when Pd prices skyrocketed.  Using pre-plated PdNi 
lead frames allows them to eliminate post-molded lead plating and in the 
time period when they introduced PdNi SnPb plating had been the standard 
lead plating so the big saving to them was not having to handle Pb 
effluent in spend plating baths.  So they eliminated the cost of the 
plating chemicals , the cost of the plating process, and the cost 
associated with disposal of spent plating chemistry.  The addition of Au 
to PdNi came about because several of us who were using TI PdNi components 
found that components in inventor were losing their solderability because, 
as you said, the Pd is a good catalyst material and pulls stuff out of the 
air.  So their response was to put Au on the Pd to protect the Pd rather 
than as an added protection for the Ni.

Regards,
George
George M. Wenger
Senior Principal FMA  / Reliability Engineer
Andrew Corporation - Wireless Network Solutions
40 Technology Drive, Warren, NJ 07059
(908) 546-4531 Office (732) 309-8964 Mobile
E-mail: [log in to unmask]

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Thursday, August 26, 2010 8:28 AM
To: [log in to unmask]
Subject: Re: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT 
PARTS

Hi Inge - the history of the Ni/Pd/Au plating stackup is kinda 
interesting. There has been lots of industry Pd plating soldering and 
wirebonding investigations during the last 50 years. The work that has 
always caught my attention was the published data in the late 1980s and 
early 1990s. Texas Instruments investigated the use of Ni/Pd plating as a 
substitute material for component leadframe spot silver process which was 
part of the component wirebonding protocol. I was told that using Ni/Pd 
provided both some technical and process advantages. Texas Instruments 
patented the Ni/Pd plating concept (in terms of component applications) 
and then implemented the concept on their component processes.  The whole 
concept was almost wiped out as the price of Pd skyrocketed (4X-5X price 
increases per troy ounce)  for a couple of years as a couple of countries 
(Russia and South Africa were the rumored conspirators) locked up their Pd 

stockpiles and messed up the global market. The insanity passed and things 

went back to normal. Texas Instruments amended its patent to include a 
flash gold to seal off the Pd from the environment degradation (Pd is a 
good catalyst material so it tended to react with some storage 
environments resulting in a loss of solderability).  The Pd layer is not 
very thick as you can get Pd embrittlement in a similar fashion to Au 
embrittlement. As Richard detailed, we are really soldering to the Ni 
plating with the Pd and Au being oxidation protectors of the Ni surface. 
In the early 2000s, the RoHS actions began and since Ni/Pd/Au doesn't 
create tin whiskers, life suddenly became very good for the surface 
finish. Additionally, the industry interest in ENEPIG is another extension 

of the industry assessing Pd, in combination with Ni and Au, for both 
soldering and wirebonding characteristics.  It appears that the industry 
fascination with Pd is going to be a topic of interest for quite some 
time.

Dave



Inge <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
08/25/2010 11:01 AM
Please respond to
Inge <[log in to unmask]>


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Subject
Re: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT PARTS






Dave,

What's the idea with mixing Nickel and Palladium on component leads? In 
general, Pd is used as a substitute for Rhodium in order to increase the 
wear resistance for e.g. sliding contacts.  I have also seen that mixing 
Ni 
an Pd causes an increase of  the internal stress, rather much, depending 
on 
the wt%. What pays for the extra process in this case?
/Inge



--------------------------------------------------
From: "David D. Hillman" <[log in to unmask]>
Sent: den 25 August 2010 00:21
To: <[log in to unmask]>
Subject: Re: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT 
PARTS

> Hi! Yes, I made the assumption that Jon really meant Pd and not Pt as I
> haven't  run into a NiPtAu surface finish on components yet.
>
> Dave
>
>
>
> "Stadem, Richard D." <[log in to unmask]>
> 08/24/2010 04:54 PM
>
> To
> TechNet E-Mail Forum <[log in to unmask]>, "[log in to unmask]"
> <[log in to unmask]>, "Roberts, Jon (SA-1)"
> <[log in to unmask]>
> cc
>
> Subject
> RE: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT PARTS
>
>
>
>
>
>
> Well, jeez, Dave. You beat me to it again. Except I was busy trying to
> find my references to soldering with platinum, not palladium.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
> Sent: Tuesday, August 24, 2010 4:13 PM
> To: [log in to unmask]
> Subject: Re: [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT
> PARTS
>
> Hi Jon! There are a couple things to remember when dealing with NiPdAu
> surface finishes: 1) Pd diffuses very slowly into a tin/lead solder 
alloy.
>
> You may need to add a few seconds to your soldering process cycle time; 
2)
>
> Adding an additional 5-10C of temperature will assist in the Pd 
diffusion
> into the tin/lead solder alloy. You may need to increase your soldering
> temperature depending on which soldering process  you are using; 3) Some
> flux material are not compatible with Pd materials. You may want to try 
a
> different flux to see if you get an improved reaction; 4) Run a
> solderability test per IPC JSTD 002 to make sure you have an acceptable
> NiPdAu surface finish. When Texas Instruments first introduced the 
NiPdAu
> surface finish, we had to make slight time/temperature/flux adjustments 
on
>
> our typical soldering processes to obtain our expected soldering 
results.
> Good Luck.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
>
>
> "Roberts, Jon (SA-1)" <[log in to unmask]>
> Sent by: TechNet <[log in to unmask]>
> 08/24/2010 12:41 PM
> Please respond to
> TechNet E-Mail Forum <[log in to unmask]>; Please respond to
> "Roberts, Jon (SA-1)" <[log in to unmask]>
>
>
> To
> [log in to unmask]
> cc
>
> Subject
> [TN] SOLDERABLIITY ON NICKEL PLATIUM GOLD LEAD FINISH SMT PARTS
>
>
>
>
>
>
> Have any of you experience difficulty in producing an acceptable solder
> joint with Nickel platinum gold SMT lead finishes?  We can rework at
> least twice to achieve an acceptable condition.  Lead free part but we
> use a solder with lead.  Any help is appreciated.  Jon
>
>
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