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Wed, 25 Aug 2010 08:11:41 -0700 |
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The spec does not discriminate between electroless and electrolytic
therefore it is Cu plating and counts.
Jim
-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Jose A
Rios
Sent: Wednesday, August 25, 2010 7:40 AM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] wrap and electroless
you cant see enough electroless in a microsection to measure it, even at
500 or 1000x unless you're really 'globbing it on'.
if you're counting on eless to meet the wrap requirement, thats a
loosing
proposition. at least for 'medium-build' eless chemistry setups.
in the event a 'high-build' eless application is employed, and the
deposit
is measurable, i dont see why you cant count it toward meeting the wrap
requirement....
Joey Rios
PWB & Process Quality Eng'r
Endicott Interconnect Technologies
1093 Clark St.
Endicott, NY 13760
Office: 607-755-5896
Chris Mahanna <[log in to unmask]>
Sent by: IPC-600-6012 <[log in to unmask]>
08/24/2010 08:52 PM
Please respond to
"(Combined Forum of D-33a and 7-31a Subcommittees)"
<[log in to unmask]>
To
[log in to unmask]
cc
Subject
[IPC-600-6012] wrap and electroless
another opinion poll, of sorts:
With even the most discriminating customers allowing 0.0002" wrap, and
huge aspect ratios leading to thicker electroless, the assumption that
wrapped electroless counts as wrap becomes more and more important. I
assume that everyone is counting it?
Thanks,
Chris
Chris Mahanna
President, Technical Manager
Robisan Laboratory Inc.
6502 E. 21st Street
Indianapolis, Indiana 46219
317-353-6249
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