Hey Joey.
I don't disagree that we're talking small, but at 50 microinch medium build, that is 1/4 of the wrap requirement.  With huge aspect ratios and these "no negative etchback" drawing notes, I don't see the eless getting thinner anytime soon :).
Chris

-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Jose A Rios
Sent: Wednesday, August 25, 2010 7:40 AM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] wrap and electroless

you cant see enough electroless in a microsection to measure it, even at 
500 or 1000x unless you're really 'globbing it on'.
if you're counting on eless to meet the wrap requirement, thats a loosing 
proposition. at least for 'medium-build' eless chemistry setups.

in the event a 'high-build' eless application is employed, and the deposit 
is measurable, i dont see why you cant count it toward meeting the wrap 
requirement....

Joey Rios
PWB & Process Quality Eng'r
Endicott Interconnect Technologies
1093 Clark St.
Endicott, NY 13760
Office: 607-755-5896



Chris Mahanna <[log in to unmask]> 
Sent by: IPC-600-6012 <[log in to unmask]>
08/24/2010 08:52 PM
Please respond to
"(Combined Forum of D-33a and 7-31a Subcommittees)" <[log in to unmask]>


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Subject
[IPC-600-6012] wrap and electroless






another opinion poll, of sorts:
With even the most discriminating customers allowing 0.0002" wrap, and 
huge aspect ratios leading to thicker electroless,  the assumption that 
wrapped electroless counts as wrap becomes more and more important.  I 
assume that everyone is counting it?

Thanks,
Chris

Chris Mahanna
President, Technical Manager
Robisan Laboratory Inc.
6502 E. 21st Street
Indianapolis, Indiana 46219
317-353-6249


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