The electroless is expected to meet the rigors of thermal stress just as 
the electrolytic plated copper, so, yes, it should be counted. As to the 
difference in mechanical properties of electroless from electrolytic 
copper, that's one of the reasons we have moved to direct metal. I don't 
recall one thermal shock failure at the interconnect (assuming no smear is 
present) since we qualified our process.
Tom Kemp
Rockwell Collins Printed Circuits



Jose A Rios <[log in to unmask]> 
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08/25/2010 06:40 AM
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Re: [IPC-600-6012] wrap and electroless






you cant see enough electroless in a microsection to measure it, even at 
500 or 1000x unless you're really 'globbing it on'.
if you're counting on eless to meet the wrap requirement, thats a loosing 
proposition. at least for 'medium-build' eless chemistry setups.

in the event a 'high-build' eless application is employed, and the deposit 

is measurable, i dont see why you cant count it toward meeting the wrap 
requirement....

Joey Rios
PWB & Process Quality Eng'r
Endicott Interconnect Technologies
1093 Clark St.
Endicott, NY 13760
Office: 607-755-5896



Chris Mahanna <[log in to unmask]> 
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08/24/2010 08:52 PM
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[IPC-600-6012] wrap and electroless






another opinion poll, of sorts:
With even the most discriminating customers allowing 0.0002" wrap, and 
huge aspect ratios leading to thicker electroless,  the assumption that 
wrapped electroless counts as wrap becomes more and more important.  I 
assume that everyone is counting it?

Thanks,
Chris

Chris Mahanna
President, Technical Manager
Robisan Laboratory Inc.
6502 E. 21st Street
Indianapolis, Indiana 46219
317-353-6249


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