going back to 6012b, the extra copper thickness provision required by 3/a 
is in the context of pth thickness.
with the updated 3/a table in 6012c, that context isnt explicitely stated, 
i dont recall the intent to apply increased copper thickness to surface 
wrap, only to pth's.

Joey Rios
PWB & Process Quality Eng'r
Endicott Interconnect Technologies
1093 Clark St.
Endicott, NY 13760
Office: 607-755-5896



Wendi Boger <[log in to unmask]> 
Sent by: IPC-600-6012 <[log in to unmask]>
08/17/2010 05:07 PM
Please respond to
"(Combined Forum of D-33a and 7-31a Subcommittees)" <[log in to unmask]>


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Subject
[IPC-600-6012] Class 3/A requirements






I need some clarification on the requirement for Plating/Coating
Thickness.  The 3/A page requires additional copper thickness above
class 3 to be added to tables 3-3, 3-4 and 3-5.  Does this also apply to
the minimum wrap thickness?  (Example) Is it required for a
non-conductive filled through via to have .944 mils of wrap (table 3-3)?
It's a bit confusing as it says to apply to minimum copper average and
minimum thin areas. 

 

Wendi

 

 


 
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