Hi Bill,
Indeed, larger footprints are a recipe for not only tombstoning, but component cracking as well.
Werner

 


 

 

-----Original Message-----
From: Brooks, Bill <[log in to unmask]>
To: [log in to unmask]
Sent: Wed, Jul 7, 2010 2:37 pm
Subject: [TN] 0201 footprint requirements


I am looking for some assistance with the pad geometries for 0201 caps

and resistors... 



Is there or is there not an industry consensus on what the optimum pad

geometry should be for them? 



What I am hearing from our assembly houses differs greatly from what is

published in IPC-7351 and the land pattern tool from PCB Matrix. 



Is the max material condition footprint actually a recipe for

tombstoning? 



What have you folks seen? What do you recommend?







Bill Brooks | Datron World Communications, Inc.

PCB Designer/Engineer | Office: 760-602-7004| Fax: 760-597-3777 |

[log in to unmask]

1808 Aston Avenue, Suite 230, Carlsbad, CA 92008 | www.dtwc.com



Performance You Require. Value You ExpectTM







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