Hi Dave - I recommend that you have a second sample analyzed. Nickel has
an extremely slow diffusion rate at 250C in tin/lead solder so unless you
have been "suddenly" running a large volume of ENIG pwbs or some other
source of nickel across the solder pot, you should not see such a large
jump in the Ni%. Solder can get "gritty" as nickel contamination levels of
0.25% (per AWS Soldering Handbook). I have a reference paper from either
Mackay or Thwaites in the files - I'll pull it up and let you know what
they found in their testing.
Dave Hillman
Rockwell Collins
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David R1 Nelson <[log in to unmask]>
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[TN] Ni in Eutectic SnPb solder
We have come upon a situation where the trace element Ni is above the
J-STD-001D threshold for an assembly wave solder machine with a reading of
0.015% to 0.020%. I'd like to know if anyone has experience or knows of
any studies done to determine the impact of this higher limit on the
products produced using this equipment. All advice/references would be
appreciated.
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