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July 2010

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Subject:
From:
David R1 Nelson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, David R1 Nelson <[log in to unmask]>
Date:
Wed, 7 Jul 2010 15:33:40 -0500
Content-Type:
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text/plain (94 lines)
Does ICP sound familiar. We aren't questioning the measurement technique.
Samples from other equipment were tested at the same time with no
anomalies noted. Repeated testing of the questionable equipment were also
consistent.




From:
Victor Hernandez <[log in to unmask]>
To:
[log in to unmask]
Date:
07/07/2010 03:26 PM
Subject:
Re: [TN] Ni in Eutectic SnPb solder
Sent by:
TechNet <[log in to unmask]>



How was this measurement conducted?   XRF or SEM/EDX.

"X"

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David R1 Nelson
Sent: Wednesday, July 07, 2010 2:59 PM
To: [log in to unmask]
Subject: [TN] Ni in Eutectic SnPb solder

We have come upon a situation where the trace element Ni is above the
J-STD-001D threshold for an assembly wave solder machine with a reading of

0.015% to 0.020%. I'd like to know if anyone has experience or knows of
any studies done to determine the impact of this higher limit on the
products produced using this equipment. All advice/references would be
appreciated.

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