prepare a professional report (NASA, Lockheed Martin, Oreal, ESTEC, Boeing
etc customers) with all arguments for a better way of MMIC mounting. Full
list of references and stds. Will see if I can involve you. Sending
pictures offline to you.
/Inge
--------------------------------------------------
From: "Steven Creswick" <[log in to unmask]>
Sent: den 7 July 2010 17:14
To: <[log in to unmask]>
Subject: Re: [TN] Hybrid precap q
> Inge,
>
> I would cut back on the adhesive deposited and dictate less than or equal
> to
> 50% climb up the side of the device.
>
> They can verify bond strength and coverage by die shear. They could also
> verify coverage by cutting thin glass plate to the size of the devices and
> inspecting after placement.
>
> I agree with your concern.
>
> Can I get part of your fee?? .... I work for fuel costs.... :-)
>
> Steve C
>
>
> On Wed, Jul 7, 2010 at 6:16 AM, Inge <[log in to unmask]> wrote:
>
>> Hi all,
>> will be back with quiz 11, but before that , I have a q about silver
>> epoxy
>> mounting MMIC chips. The amount of glue is so rich, that the silver
>> epoxy
>> wets all the way up the walls and stops just before the horizontal plane
>> of
>> the chip. Now, some conductors are as close to the chip edge as two times
>> the diameter of a bond wire, which is about 50 um. I dislike such a small
>> distance between the silver and the conductors. I'm doing a consulting
>> job
>> for a company, and they mean that this space is enough. The chips are in
>> a
>> laserwelded kovar package, so they are well protected, but I'm still not
>> satisfied. I've seen too much of migration issues in my days. The
>> packages
>> are class S. What are your opinions?
>> Thanks in advance
>> /Inge
>>
>
>
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