One (?) question about MARKING:

I was reviewing J-STD-609 to find out if my RoHS compliant board needs to be
marked, and unless I'm reading it wrong, paragraph 7.1 says
"any printed circuit board surface finish with lead (Pb) >0.1% *shall *be
marked with the lead (Pb) category b0" (and may also be marked with
materials in 5.1), which I assume means the bare board shall be marked (can
you mark a finish? ha).

but this seems kind of backwards to me. We have bazillions of assemblies out
there containing Pb that are NOT marked, and it seems like we should now
begin marking the COMPLIANT boards.

So is everyone marking now? Can anyone give a little insight on whether most
modern boards are being marked on the bare board with silkscreen or etch, or
if assemblies are being marked at the end with labels or equivalent?

I already ordered my first bare board prototypes, but maybe I should have
added the /126 b4 e1 UR (or whatever) string at the bare board level?

Jack (aka "the new guy")


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