I hope someone on this fourm can help me.  This is the application:
1.0x0.06" ceramic disk with a strip of metalization 800x170 mil. on each
side.
The metalization/trace is sputtered on the ceramic of:
    0.2 microns of Titanium against the ceramic
    1.0 microns of Nickel-Vinadium
    0.8 microns of Silver
    0.4 microns of Titanium
    1.0 microns of Nickel-Vinadium
    1.6 microns of Silver on top (Total of 5 microns of metalization)
 
    A 0.060" high temp solder ball (93.5 Pb, 5 Sn, 1.5 Ag) is built on
the trace near one of
the ends on both sides.  The entire part is then coated with 1-3 mils of
Teflon PFA.  The part
is cured @ 350F for 10 min., then at 650F for another 10 min.  The
solder ball (also coated)
is then cut in half with a wire cutter to make a solderable surface to
make a wire connection.  
    What I am wondering is, is there some type of mask that can be put
down on the trace
instead of a "blob" of solder.  Then removed, and still be able to
solder a wire to the underlying
silver metalization?  The only reason the solder ball is placed on the
part is to be able to have
something to solder to after the coating of the Teflon.  Any other ideas
are welcome.  Thank
you in advance.
 
Best Regards,
 
Michael Forrester
Sr. Product Engineer
 
Siemens Healthcare Diagnostics
101 Silvermine Rd.
Brookfield, CT  06804
PH: (203) 740-6452
 

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