TECHNET Archives

July 2010

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Wed, 21 Jul 2010 13:08:05 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (85 lines)
Add the ipc allow for 50% trace narrowing or cut, you should never use it at its full capability. 
--------------------------
Sent using BlackBerry


----- Original Message -----
From: Jack Olson [mailto:[log in to unmask]]
Sent: Wednesday, July 21, 2010 10:46 AM
To: [log in to unmask] <[log in to unmask]>
Subject: Re: [TN] SMT PAD Current Capability

I think you should be careful trying to calculate current carrying capacity this 
way. For one thing, although 1oz. copper is theoretically 1.4mils, with plating 
and tolerances and processing it can be more like 1.8-2.0 for external layers 
and .98 mil for internal when all is said and done (see Table  3-11 and 3-12 of 
IPC-6012)
To calculate the trace width itself you are going to have to factor in the 
acceptable temperature rise and other factors like proximity to heat sinks 
(planes?), and as long as your pad is as wide as your trace you should be 
okay, right? If your pad is wider than your trace, I can't imagine what the 
worry would be. This article might help:
http://www.frontdoor.biz/HowToPCB/HowToPCB-extra/HowTo2152.pdf

Unless what you were really leading up to was the current through the solder 
joint itself, and I have never heard anyone discuss that (solder much poorer 
conductor than copper)

Jack

.
On Tue, 20 Jul 2010 11:34:24 -0400, Forrester, Michael (H USA) 
<[log in to unmask]> wrote:

>I'm a bit confused on how to calculate the current capability of a SMT
>pad.  We have a 2220 size chip bead that has 8A flowing through it.
>Our pad geometry is built per IPC specifications but the manufacturers
>datasheet calls out for a PAD twice the width (part max is 10A). 
>So the question came up, with our current pad geometry (to IPC), what is
>the current capability?  I understand that it is based on the 
>cross sectional area of the copper.  The current density of copper is
>4.02 A/sq-mm.  For a 1 oz copper trace the area is 
>1.4 mils x trace width.  But what do I use for a PAD?  I have an width,
>length, and thickness.  For instance I have a SMT pad that 
>is 1.5mm X 6mm using 1 oz copper with multiple traces coming off of the
>pad.  What is the current carring capability of that pad?   
>Or am I thinking about this wrong?  Thank you.
> 
>Best Regards,
> 
>Michael Forrester
>Sr. Product Engineer
> 
>Siemens Healthcare Diagnostics
>101 Silvermine Rd.
>Brookfield, CT  06804
>PH: (203) 740-6452

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------------------------
This transmission (including any attachments) may contain confidential information, privileged material (including material protected by the solicitor-client or other applicable privileges), or constitute non-public information. Any use of this information by anyone other than the intended recipient is prohibited. If you have received this transmission in error, please immediately reply to the sender and delete this information from your system. Use, dissemination, distribution, or reproduction of this transmission by unintended recipients is not authorized and may be unlawful.

______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2