Dear TechNetters,
Thank you for your useful advice since the inception of TechNet. We are
looking for a high volume package manufacturer who can produce BGA molded
package smaller than 4 mm x 4 mm x 0.25 mm (thickness without solder
balls/bumps). Solder ball/bump pitch is 0.5 to 0.7 mm.
Thanks.
Syed Sajid Ahmad, Manager of Engineering Services
Center for Nanoscale Science and Engineering (CNSE)
North Dakota State University (NDSU), Fargo ND
http://www.ndsu.edu/cnse/




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