Thanks, Rudy! We will give it a shot.
Bev
From: R Sedlak [mailto:[log in to unmask]]
Sent: Monday, July 19, 2010 05:52 PM
To: TechNet E-Mail Forum <[log in to unmask]>; Bev Christian
Subject: Re: [TN] Removing gold and leaving nickel unaffected
So, using the obvious, going to Google, typing in Iodine Gold Etch...
One of the entries was the following:
Gold and iodine form gold iodide via 2 Au + I2 2 AuI.
The solubility of AuI is improved by adding KI to the solution. Iodine/iodide can be substituted by other halogenides excepting fluorine which does not form soluble gold compounds.
In a mixing ratio of KI:I2 :H2O=4g:1g:40ml,
[To clarify that is 4 grams KI, 1 gram Iodine, 40 mls water]
a room temperature etch rate of approx. 1 μm/min gold is attained. Copper reveals a comparable etch rate, while nickel is only etched in case of current linkage to gold.
[Note about this last line: EN is MUCH more corrosion resistant than pure Nickel]
Good luck
Rudy Sedlak
--- On Mon, 7/19/10, Bev Christian <[log in to unmask]> wrote:
From: Bev Christian <[log in to unmask]>
Subject: [TN] Removing gold and leaving nickel unaffected
To: [log in to unmask]
Date: Monday, July 19, 2010, 11:38 AM
TechNetters,
is there a way of chemically removing an ENIG gold layer and not attacking the underlying nickel without using cyanide?
Bev
RIM
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