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July 2010

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Subject:
From:
Mike Buetow <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Mike Buetow <[log in to unmask]>
Date:
Fri, 16 Jul 2010 12:58:26 -0400
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"Using springs and glue instead of solder to make electronic connections
between computer chips could end one of the electronics industry's most
wasteful habits, say researchers at the Palo Alto Research Center and
Oracle.

 

http://www.technologyreview.com/computing/25792/?ref=rss

 

Haven't we been down this road before?

 

Mike Buetow

Circuits Assembly

w/m 617-327-4702

twitter.com/mikebuetow

 

>>> PCB West * Sept. 28-30, 2010 * Santa Clara, CA Convention Center <<<

 


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