"Using springs and glue instead of solder to make electronic connections
between computer chips could end one of the electronics industry's most
wasteful habits, say researchers at the Palo Alto Research Center and
Oracle.
http://www.technologyreview.com/computing/25792/?ref=rss
Haven't we been down this road before?
Mike Buetow
Circuits Assembly
w/m 617-327-4702
twitter.com/mikebuetow
>>> PCB West * Sept. 28-30, 2010 * Santa Clara, CA Convention Center <<<
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------