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July 2010

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Subject:
Re: 0201 footprint requirements
From:
Ahne Oosterhof <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Wed, 14 Jul 2010 19:52:25 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (164 lines) 
However, making the pad small may affect the paste release from the stencil,
especially as the board may not be very accurate and the board to stencil
alignment may not always be perfect.
Given all those maybe-s, the pad has to "suck" (technical term) the paste
out of the stencil and only the aligned portion of the pad does the best
"sucking".

Having fun,

Ahne.

PS: does anybody have a spec on the precision of the board image? (????????)




-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Thursday, July 08, 2010 10:20
To: [log in to unmask]
Subject: Re: [TN] 0201 footprint requirements

 Hi Bill,
Little or no extension beyond cap outline-both lengthwise and in the width.
Werner








-----Original Message-----
From: Brooks, Bill <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, Jul 8, 2010 1:09 pm
Subject: Re: [TN] 0201 footprint requirements


I see, So... what size should the land pattern be for a 0201 cap?





Bill Brooks | Datron World Communications, Inc.

PCB Designer/Engineer | Office: 760-602-7004| Fax: 760-597-3777 |

[log in to unmask]

1808 Aston Avenue, Suite 230, Carlsbad, CA 92008 | www.dtwc.com



Performance You Require. Value You ExpectTM





-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier

Sent: Wednesday, July 07, 2010 7:36 PM

To: [log in to unmask]

Subject: Re: [TN] 0201 footprint requirements





 Hi Bill,

Indeed, larger footprints are a recipe for not only tombstoning, but

component cracking as well.

Werner





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