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July 2010

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Werner Engelmaier <[log in to unmask]>
Date:
Wed, 14 Jul 2010 16:04:23 -0400
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 Hi Kevin,
No current seminar plans in the USA—with the economy the way it is, too many conferences, where I have given seminars, simply are no longer offered.
HOWEVER, what has worked in the past, companies in areas sponsor some of my seminars of interest ( the more seminars the lower the actual expenses per seminar) to them and open them up to other companies. The sponsoring company gets of course significant benefits and reductions, the expenses are spread over 20 to 50 people from different companies, and I am available for direct consulting without the costs of traveling.
This has worked very well in the past in areas with a concentration of electronics companies, like Boston, NC, CA, TX; a real WIN-WIN-WIN situation for all concerned.

 Werner


 

 

-----Original Message-----
From: Glidden, Kevin <[log in to unmask]>
To: [log in to unmask]
Sent: Wed, Jul 14, 2010 2:56 pm
Subject: Re: [TN] silver solders and thermal fatigue resistance


Thank you, Werner.



How about your reliability seminars in Boston area?  Any plans?

________________________________

From: Werner Engelmaier [mailto:[log in to unmask]]

Sent: Wednesday, July 14, 2010 2:01 PM

To: [log in to unmask]; Glidden, Kevin

Subject: Re: [TN] silver solders and thermal fatigue resistance



Hi Kevin,

I take it, you are talking adding Ag to SnPb.

The original idea, that the presence of Ag would slow down the diffusion of Ag 

from the component metallization, has to my knowledge, never been shown to be 

true. Metallurgically, such a small amount of Ag should have no significant 

effect on t any diffusion.

The addition of Ag makes SnPb somewhat stronger, but strength and reliability 

behavior in solders do not correlate. Solder has two parts of its 

characteristics speaking against any strengthening having a beneficial fatigue 

behavior effect-(1) creep, (2) solder fatigue [in the T-regimes of interest] is 

driven by LCF, which depends on a materials ductility, not strength.

Werner









-----Original Message-----

From: Glidden, Kevin <[log in to unmask]>

To: [log in to unmask]

Sent: Wed, Jul 14, 2010 1:24 pm

Subject: [TN] silver solders and thermal fatigue resistance



Greetings,





























Can anyone provide a simple description of or provide/recommend articles















regarding the role of silver addition in solders?  I've seen reference in















several articles that it was originally used as a means to mitigate migration of















silver when soldering to thick silver deposits.  I've also seen reference that















it also increases the thermal fatigue resistance.  The latter is what I am most















interested in, and would like to better understand the "why's".





























Thanks,















Kevin Glidden











































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