TECHNET Archives

July 2010

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Joe Macko <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 14 Jul 2010 12:34:45 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (66 lines)
Ken,

FYI - I worked on one production program with densely populated boards
populated with multiple BGAs, which were conformally coated with
parylene C and do not remember any BGA failures attributable to the
parylene coating. Parylene coating thickness is relatively thin at .39
to 2 mils per IPC-A-610. Removal of a parylene coated BGA is another
matter, however.




"This e-mail and any attachments are solely for the use of the addressee and may contain L-3 proprietary information that may also be defined as U.S. Government export controlled technical data. If you are an unintended recipient of this e-mail, use, disclosure or distribution of its content is prohibited. Please notify the sender by return e-mail and immediately delete this message."
 
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ken Harp
Sent: Wednesday, July 14, 2010 10:08 AM
To: [log in to unmask]
Subject: Re: [TN] Underfill as a Remedy for Electro Migration?

I have a tangential question for Doug regarding the BGA thermal cycling 
performed with conformal coating as underfill...it looks like the BGAs
in 
question were completely underfilled with conformal coating (from the
board 
up to the underside of the BGA package).  Is this correct?  Any
experience(s) 
with the effects on solder joint fatigue/reliability when using thin
film vapor 
condensate parylene coating in leiu of acrylic or Loctite products for
BGA 
underfill?

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------

-----Original Message-----

______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2