Thank you, Werner.
How about your reliability seminars in Boston area? Any plans?
________________________________
From: Werner Engelmaier [mailto:[log in to unmask]]
Sent: Wednesday, July 14, 2010 2:01 PM
To: [log in to unmask]; Glidden, Kevin
Subject: Re: [TN] silver solders and thermal fatigue resistance
Hi Kevin,
I take it, you are talking adding Ag to SnPb.
The original idea, that the presence of Ag would slow down the diffusion of Ag from the component metallization, has to my knowledge, never been shown to be true. Metallurgically, such a small amount of Ag should have no significant effect on t any diffusion.
The addition of Ag makes SnPb somewhat stronger, but strength and reliability behavior in solders do not correlate. Solder has two parts of its characteristics speaking against any strengthening having a beneficial fatigue behavior effect-(1) creep, (2) solder fatigue [in the T-regimes of interest] is driven by LCF, which depends on a materials ductility, not strength.
Werner
-----Original Message-----
From: Glidden, Kevin <[log in to unmask]>
To: [log in to unmask]
Sent: Wed, Jul 14, 2010 1:24 pm
Subject: [TN] silver solders and thermal fatigue resistance
Greetings,
Can anyone provide a simple description of or provide/recommend articles
regarding the role of silver addition in solders? I've seen reference in
several articles that it was originally used as a means to mitigate migration of
silver when soldering to thick silver deposits. I've also seen reference that
it also increases the thermal fatigue resistance. The latter is what I am most
interested in, and would like to better understand the "why's".
Thanks,
Kevin Glidden
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]<mailto:[log in to unmask]>
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask]<mailto:[log in to unmask]> with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]<mailto:[log in to unmask]>: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]<mailto:[log in to unmask]>: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
additional information, or contact Keach Sasamori at [log in to unmask]<mailto:[log in to unmask]> or
847-615-7100 ext.2815
-----------------------------------------------------
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
