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July 2010

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Subject:
Re: Underfill as a Remedy for Electro Migration?
From:
Ken Harp <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ken Harp <[log in to unmask]>
Date:
Wed, 14 Jul 2010 12:07:54 -0500
Content-Type:
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I have a tangential question for Doug regarding the BGA thermal cycling 
performed with conformal coating as underfill...it looks like the BGAs in 
question were completely underfilled with conformal coating (from the board 
up to the underside of the BGA package).  Is this correct?  Any experience(s) 
with the effects on solder joint fatigue/reliability when using thin film vapor 
condensate parylene coating in leiu of acrylic or Loctite products for BGA 
underfill?

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