HI Dave,

Thanks and it was a pleasure finally meeting you at the CALCE meeting. Finally I can put a face to that voice I hear so often on the whiskers telecons :-).

I'm certainly leaning the way of reballing based on what I'm hearing here.  if I were doing a chip replacement with the need to do some wiring, I could justify the interposer (versus redesign of the board) but this is a new design so seems not to make a lot of sense, now that I think about it (and after tossing back some Dew).  The rep says Lattice is "rethinking abandoning tin/lead" so I'm hoping that's a possibility.  With a lead time of 12 weeks for the parts (the vendors are going to cause us to have a double dip recession if they continue to hold back supply) I've got some time to check out vendors.  I'd appreciate recommendations (off-line?) from any of you who have re-ballers you trust.

Bob Landman
H&L Instruments
  _____  

From: David D. Hillman [mailto:[log in to unmask]]
To: [log in to unmask]
Sent: Fri, 09 Jul 2010 11:40:49 -0400
Subject: Re: [TN] Interposer for SAC BGA

Hi Bob - my vote would be to reball the device using a service provider 
  that can demonstrate a qualified reballing process.
  
  Dave Hillman
  Rockwell Collins
  [log in to unmask]
  
  
  
  Bob Landman <[log in to unmask]> 
  Sent by: TechNet <[log in to unmask]>
  07/09/2010 09:05 AM
  Please respond to
  TechNet E-Mail Forum <[log in to unmask]>; Please respond to
  Bob Landman <[log in to unmask]>
  
  
  To
  [log in to unmask]
  cc
  
  Subject
  [TN] Interposer for SAC BGA
  
  
  
  
  
  
  I have to use a new FPGA from Lattice and they are not offering it in 
  SnPb, only SAC balls.  This is a fpBGA 23mm sq with 484 balls in a square 
  array with no special heatsink pads.
  
  Environment is -40 to +85C, mild vibration and shock, outside environment 
  in electrical NEMA enclosures.
  
  SnPb is a must - I refuse to use lead free process for our products.
  
  Two choices:
  
  Interposer board (Bill Rollins just told me about this option 
  
  Reballing
  
  Comments please on your preference.
  
  Bob Landman
  
  
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