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July 2010

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From:
"Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (EHCOE)
Date:
Fri, 9 Jul 2010 07:47:54 -0700
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Graham,
Boy, if anyone knows outgassing it's you. I asked Doug what KBO meant
after you name. I figured it had to be Knock Before Opening or Known
Bullshitters Organization. Doug informed me it was from Sir Winston
Churchill: keep buggering on.
Hope you and your family are doing well. KBO.
Dewey   


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Graham Naisbitt
Sent: Thursday, July 08, 2010 7:09 AM
To: [log in to unmask]
Subject: Re: [TN] Underfill as a Remedy for Electro Migration?

Leif-Erik

In either option it will be important for you to consider outgassing
issues IF your application is bound for space....

Ag + H2O + Electricity = electromigration? I am guessing there might be
some ionics also involved? Maybe a conformal coating would help more,
but cleaning might be a better route? 

Just please keep-in-mind that a coating, even an underfill, seals in as
well as out and you might actually exacerbate the problem rather than
overcome it.

Regards

Graham Naisbitt - KBO

Email: [log in to unmask]
Phone: +44 (0)12 5252 1500
Web: www.gen3systems.com

On 7 Jul 2010, at 23:11, Leif Laerum wrote:

> Technetters,
> 
> We have identified electromigration as the root cause of some field
failures we have been seeing. During the troubleshooting we came across
the following NASA paper. All of the details of this paper fits our
situation perfectly. We use the same package as described. 
> 
> http://trs-new.jpl.nasa.gov/dspace/bitstream/2014/40854/1/08-23.pdf
> 
> The executive summary is that the silver in the epoxy used to attach
as die attach migrated to create a short. The migration was triggered by
humidity.
> 
> The paper suggests using underfill or conformal coating to remedy the
problem. Currently we do not use either in our process. I have some
questions regarding these:
> 
> - What are the pros and cons using either of these for this particular
purpose? IMO underfill seems the best solution for us.
> - Does anyone have any experience as to whether this is a good
solution? I am not quite understanding the "chemistry" here. 
> - Does anyone have a recommendation as to what type of underfill would
work well for this application? 
> 
> Thank you for your input.
> 
> 
> 
> --
> Leif Erik Laerum
> 
> 
> 
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