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Date: | Fri, 9 Jul 2010 17:00:35 -0400 |
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HI Dave,
Thanks and it was a pleasure finally meeting you at the CALCE meeting. Finally I can put a face to that voice I hear so often on the whiskers telecons :-).
I'm certainly leaning the way of reballing based on what I'm hearing here. if I were doing a chip replacement with the need to do some wiring, I could justify the interposer (versus redesign of the board) but this is a new design so seems not to make a lot of sense, now that I think about it (and after tossing back some Dew). The rep says Lattice is "rethinking abandoning tin/lead" so I'm hoping that's a possibility. With a lead time of 12 weeks for the parts (the vendors are going to cause us to have a double dip recession if they continue to hold back supply) I've got some time to check out vendors. I'd appreciate recommendations (off-line?) from any of you who have re-ballers you trust.
Bob Landman
H&L Instruments
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From: David D. Hillman [mailto:[log in to unmask]]
To: [log in to unmask]
Sent: Fri, 09 Jul 2010 11:40:49 -0400
Subject: Re: [TN] Interposer for SAC BGA
Hi Bob - my vote would be to reball the device using a service provider
that can demonstrate a qualified reballing process.
Dave Hillman
Rockwell Collins
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Bob Landman <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
07/09/2010 09:05 AM
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Subject
[TN] Interposer for SAC BGA
I have to use a new FPGA from Lattice and they are not offering it in
SnPb, only SAC balls. This is a fpBGA 23mm sq with 484 balls in a square
array with no special heatsink pads.
Environment is -40 to +85C, mild vibration and shock, outside environment
in electrical NEMA enclosures.
SnPb is a must - I refuse to use lead free process for our products.
Two choices:
Interposer board (Bill Rollins just told me about this option
Reballing
Comments please on your preference.
Bob Landman
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