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| Date: | Fri, 9 Jul 2010 10:28:45 -0400 |
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I wouldn't recommend mix. Interposer might be the best if you have no height restriction. If you have large enough volume, buy a batch without ball and get 3rd party put ball on. (Take off after laser marking).
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----- Original Message -----
From: Cedric ORAIN [mailto:[log in to unmask]]
Sent: Friday, July 09, 2010 10:23 AM
To: [log in to unmask] <[log in to unmask]>
Subject: Re: [TN] Interposer for SAC BGA
Why not mixed process (Backward SnPb) ?
-----Message d'origine-----
De : TechNet [mailto:[log in to unmask]] De la part de Bob Landman
Envoyé : vendredi 9 juillet 2010 16:06
À : [log in to unmask]
Objet : [TN] Interposer for SAC BGA
I have to use a new FPGA from Lattice and they are not offering it in SnPb,
only SAC balls. This is a fpBGA 23mm sq with 484 balls in a square array
with no special heatsink pads.
Environment is -40 to +85C, mild vibration and shock, outside environment in
electrical NEMA enclosures.
SnPb is a must - I refuse to use lead free process for our products.
Two choices:
Interposer board (Bill Rollins just told me about this option
Reballing
Comments please on your preference.
Bob Landman
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