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July 2010

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Wed, 7 Jul 2010 17:11:40 -0500
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TechNet E-Mail Forum <[log in to unmask]>, Leif Laerum <[log in to unmask]>
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Leif Laerum <[log in to unmask]>
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Technetters,

We have identified electromigration as the root cause of some field failures we have been seeing. During the troubleshooting we came across the following NASA paper. All of the details of this paper fits our situation perfectly. We use the same package as described. 

http://trs-new.jpl.nasa.gov/dspace/bitstream/2014/40854/1/08-23.pdf

The executive summary is that the silver in the epoxy used to attach as die attach migrated to create a short. The migration was triggered by humidity.

The paper suggests using underfill or conformal coating to remedy the problem. Currently we do not use either in our process. I have some questions regarding these:

- What are the pros and cons using either of these for this particular purpose? IMO underfill seems the best solution for us.
- Does anyone have any experience as to whether this is a good solution? I am not quite understanding the "chemistry" here. 
- Does anyone have a recommendation as to what type of underfill would work well for this application? 

Thank you for your input.



--
Leif Erik Laerum



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