Inge,

I would cut back on the adhesive deposited and dictate less than or equal to
50% climb up the side of the device.

They can verify bond strength and coverage by die shear.  They could also
verify coverage by cutting thin glass plate to the size of the devices and
inspecting after placement.

I agree with your concern.

Can I get part of your fee??  .... I work for fuel costs....   :-)

Steve C


On Wed, Jul 7, 2010 at 6:16 AM, Inge <[log in to unmask]> wrote:

> Hi  all,
> will be back with quiz 11, but before that , I have a q about silver epoxy
> mounting MMIC chips.  The amount of glue is so rich, that the silver epoxy
> wets all the way up the walls and stops just before the horizontal plane of
> the chip. Now, some conductors are as close to the chip edge as two times
> the diameter of a bond wire, which is about 50 um. I dislike such a small
> distance between the silver and the conductors.  I'm doing a consulting job
> for a company, and they mean  that this space is enough. The chips are in a
> laserwelded kovar package, so they are well protected, but I'm still not
> satisfied. I've seen too much of migration issues in my days.  The packages
> are class S. What are your opinions?
> Thanks in advance
> /Inge
>


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