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June 2010

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Subject:
From:
Frank Kimmey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Frank Kimmey <[log in to unmask]>
Date:
Tue, 1 Jun 2010 08:46:10 -0700
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Dan,
From a Designer's view I can see serious issues here.
Firstly there will be a huge risk of delam due to poor fill at traces (you will need to fill 2.4 mill minimum at trace and pad locations)
Then there is the issue of dielectric isolation between layers (only about 2 mils with one layer 1080)
Then probably some capacitive issues due to proximity of copper to signal (SI problems)
I would suggest some further discussion with your customer and possibly listing for them your concerns, then build what they ask for and try not to say "I told you so"
Or tell them you cannot guarantee the construction and no-bid to save them the bad lesson they are risking
Good luck,
FNK

Frank N Kimmey CID+
Manager - PCB Design
Powerwave Technologies Inc
Mobile - 916-670-0645

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dan Skweres
Sent: Tuesday, June 01, 2010 8:20 AM
To: [log in to unmask]
Subject: [TN] Single-ply construction

We have a customer insisting that we use a single ply of FR406 1080 between two copper layers each 1 oz. copper. One layer is a plane and the other a signal. We're quite concerned that there will be issues with fill. We don't recommend single-ply construction especially against two 1 oz. copper layers. Any thoughts, comments and/or concerns would be appreciated.
Thanks!
Dan S.

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