Hi Paul, 
I have seen no evidence that reballing produces assemblies of lesser reliability.
Werner

 


 

 

-----Original Message-----
From: Paul Edwards <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, Jun 10, 2010 1:20 pm
Subject: Re: [TN] rohs, BGAs & assembly


I Agree with Nigel...



If the time-temperature product is high enough to produce mixing the bulk solder 

joint should be good but not perfect...



However it is all a compromise anyway...If you can get only RoHS balls on BGAs 

and you need to use 6337 for the connection, the process of reballing will 

introduce undetectable additional defect sites in the component that will lead 

to decreased reliability of the final product and you will loose the reliability 

edge you are attempting to gain...



Paul



Paul Edwards

Surface Art Engineering





-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Nigel Burtt

Sent: Thursday, June 10, 2010 8:33 AM

To: [log in to unmask]

Subject: Re: [TN] rohs, BGAs & assembly



Will be OK providing your assembly can withstand high enough reflow 

temperature to get the RoHS balls to melt. usually problem is not with the 

BGA, but with other parts that won't like to get that hot!



NPL in the UK have public domain technical papers on this which you can 

download from their website 



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