Hi Dee,
Yes it can be done, but only at SAC soldering temperatures. Having said this, this brings up the issue of whether the PCB and your components can take that temperature [multiple times] and the need for adequate moisture bake out.
You should have taken my seminar I just ave at SMT Nürnberg—I do give seminars at clients as well.

 
 
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnectionand Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Cell: 386-316-5904
E-mail: [log in to unmask], Website:www.engelmaier.com


 

 

-----Original Message-----
From: Dee Stover <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, Jun 10, 2010 10:12 am
Subject: [TN] rohs, BGAs & assembly


Hi all, 
 
I need to find some written data on the long term reliability of rohs assemblies.  We don't have comply with rohs but can only get the parts in rohs, with BGA's being the main drive for rohs compliant solder. 
 
Just had an assembly vendor say that a rohs bga can be assembled with eutectic solder paste with good results.  2 other assembly shops say that is not recommended.  Is there any real studies or data available that provides the real answer?  Also studies and data for the reliability of rohs?  We need our boxes to work for 10 years or more. 
 
Thank you for your time.   What a great network for people to share knowledge.  I will also be going through PCD&F and google to (hopelessly behind on my reading) 
 
:-) Dee Stover  [log in to unmask]   520-318-8489 
Tech Associate II 
National Optical Astronomy Observatories 
www.noao.edu  
 
______________________________________________________________________ 
This email has been scanned by the MessageLabs Email Security System. 
For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ 
 
--------------------------------------------------- 
Technet Mail List provided as a service by IPC using LISTSERV 15.0 
To unsubscribe, send a message to [log in to unmask] with following text in 
the BODY (NOT the subject field): SIGNOFF Technet 
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) 
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest 
Search the archives of previous posts at: http://listserv.ipc.org/archives 
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 
----------------------------------------------------- 

 

______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------