TECHNET Archives

June 2010

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Paul Edwards <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Paul Edwards <[log in to unmask]>
Date:
Thu, 10 Jun 2010 10:20:01 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (63 lines)
I Agree with Nigel...

If the time-temperature product is high enough to produce mixing the bulk solder joint should be good but not perfect...

However it is all a compromise anyway...If you can get only RoHS balls on BGAs and you need to use 6337 for the connection, the process of reballing will introduce undetectable additional defect sites in the component that will lead to decreased reliability of the final product and you will loose the reliability edge you are attempting to gain...

Paul

Paul Edwards
Surface Art Engineering


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Nigel Burtt
Sent: Thursday, June 10, 2010 8:33 AM
To: [log in to unmask]
Subject: Re: [TN] rohs, BGAs & assembly

Will be OK providing your assembly can withstand high enough reflow 
temperature to get the RoHS balls to melt. usually problem is not with the 
BGA, but with other parts that won't like to get that hot!

NPL in the UK have public domain technical papers on this which you can 
download from their website 

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------


==============================================================================

This email and any attachments thereto may contain private, confidential, and
privileged material for the sole use of the intended recipient. Any review, copying,
or distribution of this email (or any attachments thereto) by others is strictly prohibited.
If you are not the intended recipient, please contact [log in to unmask]
immediately and permanently delete the original and any copies of this email and
any attachments thereto. 

==============================================================================


______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2