TECHNET Archives

June 2010

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
John Goulet <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 9 Jun 2010 15:37:28 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (56 lines)
To JW
I don't know if you got any answers from this old E-mail. I looked up the material specs for the SOD-323 and there is no plastic in the body. The high temp body material, phenolic resin with fire retardants and proprietary chemicals, is like the body material of SOIC and SOT parts. As you pointed out the IPC allows solder to touch the body of these glass/phenolic epoxy high temp parts.
 Solder cannot touch plastic parts since it would melt and functionally or cosmetically damage the part like:
 plastic connectors, headers, shunts etc.

----- Original Message -----
From: J W 
To: [log in to unmask]
Sent: Tue, 4 May 2010 14:58:26 +0000 (UTC)
Subject: [TN] SOD-323 package (body making contact with solder)

Hi,

Does anyone know if a SOD-323 package falls under the same rules as for SOIC
and SOT components, when it comes to solder touching the plastic body?

Per IPC 8.3.5.5 it is acceptable (all three classes) for solder to touch a
plastic SOIC or SOT component.  It is however not acceptable (class 2 and 3)
if solder touches the body of a plastic component, except for the SOIC's and
SOT's.

Thanks!
Jim


______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------


______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2