TechNetters,
I am sending a picture to Steve to post.  I have labs in three locations.  One of them has seen weird voids in cross-sections of BGAs while the other two locations have not.  For the lab that has seen them, the cross-sections were prepared by different people on different days for different products, using the same equipment. The voids are not in all balls cross-sectioned but may be only in one of two of the balls in a row of multiple solder joints examined.

Have you seen anything like this?  Do you know the root cause?

Vlad,
You know what is going on, so please don't respond.

Bev


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