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June 2010

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Subject:
From:
John Goulet <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 8 Jun 2010 19:39:52 +0000
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Hi Carl. I would consider that the arsenic remaining from the plating process is the result of poor cleaning. As a result the arsenic caused oxidation of the Sn of the plating which is a common problem for solderability problems on Sn/Pb which is usually very easy to solder.

----- Original Message -----
From: Carl Ray 
To: [log in to unmask]
Sent: Tue, 8 Jun 2010 18:44:21 +0000 (UTC)
Subject: [TN] Arsenic from XRF Testing

All,
I have a question. We were seeing some solderability issues with some components that were provided by our customer. These devices were Sn-Pb over Cu plating per the data sheet. We tested 3 samples and noticed where all three samples have very high concentration of Arsenic. Some as much  4-5%. What could possibly be the cause for this? I understand Arsenic is used during plating process but I did not think it was as significant as 4-5%.


Carl Ray

Staff Engineer
Teledyne Electronic Manufacturing Services
1425 Higgs Rd.
Lewisburg, TN 37091
Direct: 931-270-2724
Cell: 931-637-5958
Email: [log in to unmask]


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