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June 2010

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TechNet E-Mail Forum <[log in to unmask]>, 李义 <[log in to unmask]>
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Thu, 1 Jul 2010 12:01:09 +0800
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Dear Technos,

Anyone use backdrilling tech in a single pcb? We backdrilled a lot of backplanes, but none of them should survive a second reflow process and maybe a wave process.

Here is the questions:

Does the high temperature stress affect the backdrill holes reliability?  Two reflow processes and a wave process, Consider the PTHs' drilled edge are rough, maybe they will easy to be damaged by thermal stress.

Will the the rework process of the connector damage the backdrilled holes? 

Anything we can do? No HALS? More inner layer connection? Other suggestions?

Thank you so much.

B.R.
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
Li Yi 
H3C R&D DFM Engineer312 Room, Oriental Electronics Bldg., Shangdi Information 
Industry Base, Haidian District, Beijing, PRC(100085)
Tel: 8610 82774692
Fax:8610 82774214
www.H3C.com
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