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June 2010

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Subject:
From:
Dennis Fritz <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 30 Jun 2010 14:37:27 -0400
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Cedric, 

Tin electroplate is commonly used in circuit board manufacture - but nearly all is stripped off after etching to give bare copper traces (Solder Mask Over Bare Copper - SMOBC) or else Hot Air Solder Level - HASL. However, when leaving the electroplated tin on the board, you should consider the risk of tin whiskers.  Then, use one of the mitigation techniques - nickel underplate, heat fusion of the tin, conformal coat, etc.  

Denny Fritz






-----Original Message-----
From: Cedric ORAIN <[log in to unmask]>
To: TechNet <[log in to unmask]>
Sent: Wed, Jun 30, 2010 1:03 pm
Subject: [TN] Bright tin


Hello all,
I've been proposed Bright Tin as PCB finishing. It is the first time I've
eard about this plating for PCB. 
Is someone is familiar with this process and could expose drawbacks and
enefit? 
Do you confirm that it is an electroplating process? Do I need to specify a
ickel barrier or something lie that underneath the tin layer? Is the
hickness of tin is critical and has to be monitored carefully? 
I'm also concerned about tin whiskers with bright tin as it as been banned
rom the plating of connectors and components due to its propensity to the
rowth of whiskers.
Ok, it's a lot of questions!  I just want to be advised on what is important
o know about that subject.
Thanks in adavance for your bright advice.
Cedric ORAIN


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