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June 2010

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Subject:
From:
R Sedlak <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, R Sedlak <[log in to unmask]>
Date:
Wed, 30 Jun 2010 11:05:13 -0700
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Cedric:
Bright Tin is definitely electroplated, and as such can be much thicker than the more common immersion Tin, however, since it is electroplated, it covers the top of the pad, and there may be exposed Copper on the sides of the pad.

Bright Tin is high in organics, which should minimize, but not eliminate, Tin whiskers. 

Nickel is normally not used under Bright Tin, although it MIGHT help shelf life.  Shelf life of Bright Tin finish is more controlled by oxide formation on surface of Tin, rather than by intermetallic formation, because the Tin is usually so thick.

Hope this assists.
Rudy Sedlak
RD Chemical Company

--- On Wed, 6/30/10, Cedric ORAIN <[log in to unmask]> wrote:

From: Cedric ORAIN <[log in to unmask]>
Subject: [TN] Bright tin
To: [log in to unmask]
Date: Wednesday, June 30, 2010, 10:03 AM

Hello all,

I've been proposed Bright Tin as PCB finishing. It is the first time I've
heard about this plating for PCB. 

Is someone is familiar with this process and could expose drawbacks and
benefit? 

Do you confirm that it is an electroplating process? Do I need to specify a
Nickel barrier or something lie that underneath the tin layer? Is the
thickness of tin is critical and has to be monitored carefully? 

I'm also concerned about tin whiskers with bright tin as it as been banned
from the plating of connectors and components due to its propensity to the
growth of whiskers.

Ok, it's a lot of questions!  I just want to be advised on what is important
to know about that subject.

Thanks in adavance for your bright advice.

Cedric ORAIN





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