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June 2010

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Guy Ramsey <[log in to unmask]>
Date:
Mon, 28 Jun 2010 08:05:13 -0400
Content-Type:
text/plain
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text/plain (58 lines)
We saw this in early testing of Pb-Free solder. Solder would climb the leg
up to the package. 
But, then drop back down as the surface tension and wetting forces
equalized. 
This looks like something inhibited that phase of the reaction. 
I wonder if Wayne isn't on to something. The solder looks doped. 

Guy

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jerry Dengler
Sent: Monday, June 28, 2010 7:40 AM
To: [log in to unmask]
Subject: Re: [TN] QFP short at top of the leads

Jowan,

Was this part dipped in solder before placing?  It looks like solder has
coated the whole lead right up to the body.

Jerry

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Iven, Jowan
Sent: Monday, June 28, 2010 5:08 AM
To: [log in to unmask]
Subject: [TN] QFP short at top of the leads

Has anyone ever seen a QFP where shorts occur after soldering at the top
of the leads?
And the leads look pretty dull after soldering.  Any ideas?


A picture is available at
http://ipc-technet.groupsite.com/uploads/galleries/x/000/020/5ba/technet
01.jpg

Jowan Iven 





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