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June 2010

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Subject:
From:
Pete Houwen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Pete Houwen <[log in to unmask]>
Date:
Thu, 3 Jun 2010 09:09:42 -0500
Content-Type:
text/plain
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text/plain (18 lines)
routing should NEVER be placed on the top layer under a QFN.  That "big 
paddle" is a heatsink, and should be soldered to a pad on the board.   And 
even if you choose not to solder it, how can you inspect production quantity 
boards well enough to be sure the mask is providing adequate insulation?  It's 
just asking for trouble.

(but I have seen it done)

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