Keep in mind that flux which is not on or immediately adjacent to the PCB
plane probably will not have received sufficient heat to render it
completely no clean. There are mechanical concerns too if it has
contaminated the active connector area.
Whatever we might think technically customer will probably object. (That's
the third reason for cleaning, the other two being reliability in service or
interference with subsequent manufacturing process).
If you can avoid having it takes away having to think about it. How did this
flux get there? If overspray then that's possibly fixable by
correct/improved adjustment or possibly masking. You could consider plugging
dummy component into connector for example.
If it wicked up then it might be possible to fix by giving a small standoff
to the connector to break the capillary path.
Regards
Mike Fenner
Indium Corporation
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: Thursday, June 17, 2010 4:50 PM
To: [log in to unmask]
Subject: [TN] No-clean flux residue on connector
Dear Technos,
I have this issue with no-clean LF process
http://ipc-technet.groupsite.com/gallery/13891
Will it pass IPC-610 class2?
We're not running much no-clean, so I don't really know if this issue is
common with this process. Is there any way, other than masking the
connectors, to keep the flux from ending on the body of this part? I can say
we minimized the flux deposition, less than this and it will not solder.
Thanks,
Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] <mailto:[log in to unmask]>
W | www.digico.cc <http://www.digico.cc/>
N'imprimer que si nécessaire - Print only if you must
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