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June 2010

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Subject:
From:
John Goulet <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 21 Jun 2010 14:01:52 +0000
Content-Type:
text/plain
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text/plain (255 lines)
The no-clean flux residue must not be on the contacts and it is very difficult to see specially where the pins aren't flat.
Some of the No-clean fluxes leave a clear coating that could become an insulator. The no-clean resudue up on the metal housing may cosmetically get worse because if the portion didn't get hot enough to burn off the activators then you will have corrosive properties. The contacts would have gotten hot enough so you just have to be surethe typical clear coating isn't there.
 In setting up the wave recipies it is very important to establish a good spray flux recipe and with test boards with warious size holes nad Ph paper you can test that you have enough flux but not too much and that the flux isn't being blown up inside the connector too far.
If delt with this alot espcially on simm connectors. Sealed connectors makes life alot easier on the Process Engineer but sometimes you have to be creative with kapton tape under the part if thec ustomer allows it, to block the spray flux from going inside.
If it is not high volume and it is only one low pin count connector you could simply hand solder it to avoid the extra clening step if the customer demands thhat there is no flux or white residue on the part. 

----- Original Message -----
From: Lum Wee Mei 
To: [log in to unmask]
Sent: Mon, 21 Jun 2010 03:10:22 +0000 (UTC)
Subject: Re: [TN] No-clean flux residue on connector

Customer is not always right. I took a look at photo, if those tiny bits on the connector's body are flux residue, to me, I will consider them as cosmetic - classified as process indicator and not as reject. It is only a reject if the residue are found inside the contact cavities which I did not see any.

Just my 2 cents of comment.

Thanks and Regards,
~ Wee Mei ~

  _____

From: TechNet on behalf of David D. Hillman
Sent: Sat 6/19/2010 4:03 AM
To: [log in to unmask]
Subject: Re: [TN] No-clean flux residue on connector



Hi Inge! Good catch - many of us may  consider a little bit of visible
flux residue to be a cosmetic issue but if the customer decides its a
defect then it has to  come off.

Dave



Inge 
Sent by: TechNet 
06/18/2010 09:02 AM
Please respond to
Inge 


To
[log in to unmask]
cc

Subject
Re: [TN] No-clean flux residue on connector






I agree with Dave in principal (Dave is alway right...sigh. Wished the man

could be like we others and be wrong some time) . However, there is a word

that you must sometimes take into consideration: workmanship. At least
many
of our customers use this against our assuring that there is no risk
bla-bla-bla.  So, we would do something to remove the stuff.

Inge

--------------------------------------------------
From: "David D. Hillman" 
Sent: den 17 June 2010 18:33
To: 
Subject: Re: [TN] No-clean flux residue on connector

> Hi Ioan - If the reflow process renders the flux residue inert and you
do
> not have flux residue on the connector contacts, is there some
functional
> reason you don't like what we see in the photo? If the flux residues
> remaining after soldering have been correctly processed, there shouldn't
> be an issue unless you have a functional issue or an product use
> environment issue.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
>
>
> Ioan Tempea 
> Sent by: TechNet 
> 06/17/2010 10:50 AM
> Please respond to
> TechNet E-Mail Forum ; Please respond to
> Ioan Tempea 
>
>
> To
> [log in to unmask]
> cc
>
> Subject
> [TN] No-clean flux residue on connector
>
>
>
>
>
>
> Dear Technos,
>
>
>
> I have this issue with no-clean LF process
> http://ipc-technet.groupsite.com/gallery/13891
>
>
>
> Will it pass IPC-610 class2?
>
>
>
> We're not running much no-clean, so I don't really know if this issue is
> common with this process. Is there any way, other than masking the
> connectors, to keep the flux from ending on the body of this part? I can
> say we minimized the flux deposition, less than this and it will not
> solder.
>
>
>
> Thanks,
>
>
>
> Ioan Tempea, ing.
> Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
> T | 450.967.7100 ext.244
> E | [log in to unmask] 
> W | www.digico.cc 
>
>
> N'imprimer que si nécessaire - Print only if you must
>
>
>
>
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