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June 2010

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From:
Robert Kondner <[log in to unmask]>
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Date:
Mon, 21 Jun 2010 08:54:42 -0400
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Hi,

 Probing on vias is very common. The key items are via size/shape and probe
style. 

 Spacing pretty much depends on the probe type you are using. 100 mil
centers on 35 mil square targets has been around for a long time, it a very
robust probe spacing/style technology. Lots of probe head styles available. 

 Moving below 100 mils means you quickly need to start thinking about
fixture styles and alignment issues. 

Bob Kondner 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of prashant chopra
Sent: Monday, June 21, 2010 7:27 AM
To: [log in to unmask]
Subject: [TN] Use of vias as ICT pads

Hi,
 
Need input regarding the use of vias for probing during the ICT process.
 
Is there any risk if we probe via? Is it not a standard practice to save
space by probing via’s during ICT & not providing individual test point on
each net?
 
What precautions need to be taken while using via as a test pad for ICT?
What should be the minimum via size and spacing between two vias if they
need to be used for probing during the ICT?
 
Rgds
Prashant 


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