It depends. No clean flux on low insertion force connector may behave like conformal coating (most of the no clean residue has similar charcteristics as coating). Without test validate the performance of the connector with presence of the stuff is at least premature to call it "process indicator", not defect.
--------------------------
Sent using BlackBerry
----- Original Message -----
From: Lum Wee Mei [mailto:[log in to unmask]]
Sent: Sunday, June 20, 2010 11:10 PM
To: [log in to unmask] <[log in to unmask]>
Subject: Re: [TN] No-clean flux residue on connector
Customer is not always right. I took a look at photo, if those tiny bits on the connector's body are flux residue, to me, I will consider them as cosmetic - classified as process indicator and not as reject. It is only a reject if the residue are found inside the contact cavities which I did not see any.
Just my 2 cents of comment.
Thanks and Regards,
~ Wee Mei ~
_____
From: TechNet on behalf of David D. Hillman
Sent: Sat 6/19/2010 4:03 AM
To: [log in to unmask]
Subject: Re: [TN] No-clean flux residue on connector
Hi Inge! Good catch - many of us may consider a little bit of visible
flux residue to be a cosmetic issue but if the customer decides its a
defect then it has to come off.
Dave
Inge <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
06/18/2010 09:02 AM
Please respond to
Inge <[log in to unmask]>
To
[log in to unmask]
cc
Subject
Re: [TN] No-clean flux residue on connector
I agree with Dave in principal (Dave is alway right...sigh. Wished the man
could be like we others and be wrong some time) . However, there is a word
that you must sometimes take into consideration: workmanship. At least
many
of our customers use this against our assuring that there is no risk
bla-bla-bla. So, we would do something to remove the stuff.
Inge
--------------------------------------------------
From: "David D. Hillman" <[log in to unmask]>
Sent: den 17 June 2010 18:33
To: <[log in to unmask]>
Subject: Re: [TN] No-clean flux residue on connector
> Hi Ioan - If the reflow process renders the flux residue inert and you
do
> not have flux residue on the connector contacts, is there some
functional
> reason you don't like what we see in the photo? If the flux residues
> remaining after soldering have been correctly processed, there shouldn't
> be an issue unless you have a functional issue or an product use
> environment issue.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
>
>
> Ioan Tempea <[log in to unmask]>
> Sent by: TechNet <[log in to unmask]>
> 06/17/2010 10:50 AM
> Please respond to
> TechNet E-Mail Forum <[log in to unmask]>; Please respond to
> Ioan Tempea <[log in to unmask]>
>
>
> To
> [log in to unmask]
> cc
>
> Subject
> [TN] No-clean flux residue on connector
>
>
>
>
>
>
> Dear Technos,
>
>
>
> I have this issue with no-clean LF process
> http://ipc-technet.groupsite.com/gallery/13891
>
>
>
> Will it pass IPC-610 class2?
>
>
>
> We're not running much no-clean, so I don't really know if this issue is
> common with this process. Is there any way, other than masking the
> connectors, to keep the flux from ending on the body of this part? I can
> say we minimized the flux deposition, less than this and it will not
> solder.
>
>
>
> Thanks,
>
>
>
> Ioan Tempea, ing.
> Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
> T | 450.967.7100 ext.244
> E | [log in to unmask] <mailto:[log in to unmask]>
> W | www.digico.cc <http://www.digico.cc/>
>
>
> N'imprimer que si nécessaire - Print only if you must
>
>
>
>
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